GaN: from fundamentals to applications
GaN: from fundamentals to applications

Materials Science and Engineering: B (July 1999), 61-62, pg. 305-309
Jacques I. Pankove The fundamental differences between GaN and SiC are reviewed, then the problems of doping GaN are explored. The range of energy band gaps obtainable with alloys of all the III-Nitrides extends from 1.9 to 6.2 eV. Finally, various applications of the III-Nitrides are described with emphasis on solar blind UV detectors, light-emitting and modulating devices, cold cathodes and, in more detail, a heterojunction bipolar transistor that uses a SiC base layer and operates above 500°C.
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Materials Science and Engineering: B
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D. Defives; O. Noblanc; C. Dua; C. Brylinski; M. Barthula; F. Meyer
Electrical noise used as a tool for assessing the defectivity of SiC Schottky diodes
A.S. Royet; T. Ouisse; T. Billon; C. Jaussaud; B. Cabon
A.S. Royet; T. Ouisse; T. Billon; C. Jaussaud; B. Cabon
Improvements in Pt-based Schottky contacts to 3C–SiC
G. Constantinidis; B. Pecz; K. Tsagaraki; M. Kayambaki; K. Michelakis
G. Constantinidis; B. Pecz; K. Tsagaraki; M. Kayambaki; K. Michelakis
Optimisation of a power 4H–SiC SIT device for RF heating applications
S. Ortolland; C.M. Johnson; N.G. Wright; D.J. Morrison; A.G. O’Neill
S. Ortolland; C.M. Johnson; N.G. Wright; D.J. Morrison; A.G. O’Neill
Numerical simulation of implanted top-gate 6H–SiC JFET characteristics
M. Lades; D. Berz; U. Schmid; S.T. SheppardPresent address: Cree Research, 4022 Stirrup Creek Dr., Suite 322, Durham, NC 27703, USA.; N. KaminskiPresent address: ABB Semiconductors AG, Fabrikstr. 3, 5600 Lenzburg, Switzerland.; W. Wondrak; G. Wachutka
M. Lades; D. Berz; U. Schmid; S.T. SheppardPresent address: Cree Research, 4022 Stirrup Creek Dr., Suite 322, Durham, NC 27703, USA.; N. KaminskiPresent address: ABB Semiconductors AG, Fabrikstr. 3, 5600 Lenzburg, Switzerland.; W. Wondrak; G. Wachutka
P–N Junction creation in 6H-SiC by aluminum implantation
L. Ottaviani; M.L. Locatelli; D. Planson; K. Isoird; J.P. Chante; E. Morvan; P. Godignon
L. Ottaviani; M.L. Locatelli; D. Planson; K. Isoird; J.P. Chante; E. Morvan; P. Godignon
On the interpretation of high frequency capacitance data of 6H-SiC boron compensated pin junction
Gh. Brezeanu; M. Badila; B. Tudor; J. Millan; P. Godignon; J.P. Chante; M.L. Locatelli; A. Lebedev; V. Banu
Gh. Brezeanu; M. Badila; B. Tudor; J. Millan; P. Godignon; J.P. Chante; M.L. Locatelli; A. Lebedev; V. Banu
Current–voltage characteristics of large area 6H-SiC pin diodes
M. Badila; B. Tudor; Gh. Brezeanu; M.L. Locatelli; J.P. Chante; J. Millan; Ph. Godignon; A. Lebedev; V. Banu
M. Badila; B. Tudor; Gh. Brezeanu; M.L. Locatelli; J.P. Chante; J. Millan; Ph. Godignon; A. Lebedev; V. Banu
Influence of proton irradiation on recombination current in 6H–SiC pn structures
A.M. Strel'chuk; V.V. Kozlovski; N.S. Savkina; M.G. Rastegaeva; A.N. Andreev
A.M. Strel'chuk; V.V. Kozlovski; N.S. Savkina; M.G. Rastegaeva; A.N. Andreev
Large area silicon carbide devices fabricated on SiC wafers with reduced micropipe density
V. Dmitriev; S. Rendakova; N. Kuznetsov; N. Savkina; A. Andreev; M. Rastegaeva; M. Mynbaeva; A. Morozov
V. Dmitriev; S. Rendakova; N. Kuznetsov; N. Savkina; A. Andreev; M. Rastegaeva; M. Mynbaeva; A. Morozov
Studies of the effect of proton irradiation on 6H-SiC pn junction properties
Alexandre A. Lebedev; Anatoly M. Strel’chuk1; Vitali V. Kozlovski; Natalia. S. Savkina; Denis V. Davydov; Viktor V. Solov’ev
Alexandre A. Lebedev; Anatoly M. Strel’chuk1; Vitali V. Kozlovski; Natalia. S. Savkina; Denis V. Davydov; Viktor V. Solov’ev
Oxygen in silicon carbide: shallow donors and deep acceptors
Thomas DaliborPresent address: ABB Semiconductors AG, Fabrikstr. 3, CH-5600 Lenzburg, Switzerland.; Hubert Trageser; Gerhard Pensl; Tsunenobu Kimoto; Hiroyuki Matsunami; Daniel Nizhner; Oleg Shigiltchoff; Wolfgang J. Choyke
Thomas DaliborPresent address: ABB Semiconductors AG, Fabrikstr. 3, CH-5600 Lenzburg, Switzerland.; Hubert Trageser; Gerhard Pensl; Tsunenobu Kimoto; Hiroyuki Matsunami; Daniel Nizhner; Oleg Shigiltchoff; Wolfgang J. Choyke
Quality and reliability of wet and dry oxides on n-type 4H-SiC
Carl J. Anthony; Allan J. Jones; Michael J. Uren
Carl J. Anthony; Allan J. Jones; Michael J. Uren
Structural defect visualization and oxide breakdown in SiC wafers after thermal oxidation
T.S. Sudarshan; S. Soloviev; I. Khlebnikov; V. Madangarli
T.S. Sudarshan; S. Soloviev; I. Khlebnikov; V. Madangarli
H2 surface treatment for gate-oxidation of SiC metal-oxide-semiconductor field effect transisitsors
Katsunori Ueno; Ryuichi Asai; Takashi Tsuji
Katsunori Ueno; Ryuichi Asai; Takashi Tsuji
A study about the wet oxidation of crystalline and ion damaged 6H-SiC
R. Nipoti; M. Madrigali; A. Sambo
R. Nipoti; M. Madrigali; A. Sambo
γ-Ray irradiation effects on 6H-SiC MOSFET
Takeshi Ohshima; Masahito Yoshikawa; Hisayoshi Itoh; Yasushi AokiPresent address: Sumitomo Heavy Industries, 2-1-1 Yato, Tanashi, Tokyo 188-8585, Japan.; Isamu Nashiyama
Takeshi Ohshima; Masahito Yoshikawa; Hisayoshi Itoh; Yasushi AokiPresent address: Sumitomo Heavy Industries, 2-1-1 Yato, Tanashi, Tokyo 188-8585, Japan.; Isamu Nashiyama
Oxidation of 6H silicon carbide in carbon containing atmosphere
Kai Christiansen; Michael Bassler; Thomas DaliborPresent address. ABB Semiconductors AG, Fabrikstr. 3, CH- 5600 Lenzburg, Switzerland.; Reinhard Helbig
Kai Christiansen; Michael Bassler; Thomas DaliborPresent address. ABB Semiconductors AG, Fabrikstr. 3, CH- 5600 Lenzburg, Switzerland.; Reinhard Helbig
Long-time constant-capacitance DLTS investigations of 6H SiC/MOS structures: comparison of dry and wet oxidation
M. Bassler; G. Pensl
M. Bassler; G. Pensl
Electrical characterization of 6H–SiC enhancement-mode MOSFETs at high temperatures
U. Schmid; S.T. Sheppard; W. Wondrak; E. Niemann
U. Schmid; S.T. Sheppard; W. Wondrak; E. Niemann
Design of a 600 V silicon carbide vertical power MOSFET
D. Planson; M.L. Locatelli; F. Lanois; J.P. Chante
D. Planson; M.L. Locatelli; F. Lanois; J.P. Chante
Characterization of an enhanced thermal oxide layer on 6H–SiC using ion irradiation
T. Yoneda; T. Nakata; M. Watanabe; M. Kitabatake
T. Yoneda; T. Nakata; M. Watanabe; M. Kitabatake
Atomic control of Si-terminated cubic silicon carbide (100) surfaces: morphology and self-organized atomic lines
P. Soukiassian
P. Soukiassian
Heteroepitaxial growth of 3C-SiC on SOI for sensor applications
G. Krötz; H. Möller; M. Eickhoff; S. Zappe; R. Ziermann; E. Obermeier; J. Stoemenos
G. Krötz; H. Möller; M. Eickhoff; S. Zappe; R. Ziermann; E. Obermeier; J. Stoemenos
Stabilization of the 3C-SiC/SOI system by an intermediate silicon nitride layer
S. Zappe; E. Obermeier; J. Stoemenos; H. Möller; G. Krötz; H. Wirth; W. Skorupa
S. Zappe; E. Obermeier; J. Stoemenos; H. Möller; G. Krötz; H. Wirth; W. Skorupa
Spectroscopic ellipsometry studies of heteroepitaxially grown cubic silicon carbide layers on silicon
J. Scheiner; R. Goldhahn; V. Cimalla; G. Ecke; W. Attenberger; J.K.M. Lindner; G. Gobsch; J. Pezoldt
J. Scheiner; R. Goldhahn; V. Cimalla; G. Ecke; W. Attenberger; J.K.M. Lindner; G. Gobsch; J. Pezoldt
The physics of heteroepitaxy of 3C–SiC on Si: role of Ge in the optimization of the 3C–SiC/Si heterointerface
P. Masri; N. Moreaud; M. Rouhani Laridjani; J. Calas; M. Averous; G. Chaix; A. Dollet; R. Berjoan; C. Dupuy
P. Masri; N. Moreaud; M. Rouhani Laridjani; J. Calas; M. Averous; G. Chaix; A. Dollet; R. Berjoan; C. Dupuy
The evolution of cavities in Si at the 3C-SiC/Si interface during 3C-SiC deposition by LPCVD
V. Papaioannou; H. Möller; M. Rapp; L. Vogelmeier; M. Eickhoff; G. Krötz; J. Stoemenos
V. Papaioannou; H. Möller; M. Rapp; L. Vogelmeier; M. Eickhoff; G. Krötz; J. Stoemenos
Structural and morphological investigations of the initial stages in solid source molecular beam epitaxy of SiC on (111)Si
W. Attenberger; J. Lindner; V. Cimalla; J. Pezoldt
W. Attenberger; J. Lindner; V. Cimalla; J. Pezoldt
Low temperature SiC growth by metalorganic LPCVD on MBE carbonized Si (001) substrates
E. Hurtós; J. Rodríguez-Viejo; J. Bassas; M.T. Clavaguera-Mora; K. Zekentes
E. Hurtós; J. Rodríguez-Viejo; J. Bassas; M.T. Clavaguera-Mora; K. Zekentes
Influence of the heating ramp on the heteroepitaxial growth of SiC on Si
V. Cimalla; Th. Stauden; G. Eichhorn; J. Pezoldt
V. Cimalla; Th. Stauden; G. Eichhorn; J. Pezoldt
CVD growth of 3C-SiC on SOI (100) substrates with optimized interface structure
F. Wischmeyer; W. Wondrak; D. Leidich; E. Niemann
F. Wischmeyer; W. Wondrak; D. Leidich; E. Niemann
Influence of the silicon overlayer thickness of SOI unibond substrates on β-SIC heteroepitaxy
H. Möller; M. Eickhoff; L. Vogelmeier; M. Rapp; G. Krötz; V. Papaioannou; J. Stoemenos
H. Möller; M. Eickhoff; L. Vogelmeier; M. Rapp; G. Krötz; V. Papaioannou; J. Stoemenos
Investigation of porous silicon as a new compliant substrate for 3C-SiC deposition
F. Namavar; P.C. Colter; N. Planes; B. Fraisse; J. Pernot; S. Juillaguet; J. Camassel
F. Namavar; P.C. Colter; N. Planes; B. Fraisse; J. Pernot; S. Juillaguet; J. Camassel
High temperature piezoresistive β-SiC-on-SOI pressure sensor with on chip SiC thermistor
R. Ziermann; J. von Berg; E. Obermeier; F. Wischmeyer; E. Niemann; H. Möller; M. Eickhoff; G. Krötz
R. Ziermann; J. von Berg; E. Obermeier; F. Wischmeyer; E. Niemann; H. Möller; M. Eickhoff; G. Krötz
Heteroepitaxial growth of 3C–SiC using HMDS by atmospheric CVD
Y. Chen; K. Matsumoto; Y. Nishio; T. Shirafuji; S. Nishino
Y. Chen; K. Matsumoto; Y. Nishio; T. Shirafuji; S. Nishino
Growth of beta SiC on a ceramic SiC substrate using a thin silicon intermediate layer
Crawford Taylor; Ebenezer Eshun; M.G. Spencer; K.D. Hobart; F.J. Kub
Crawford Taylor; Ebenezer Eshun; M.G. Spencer; K.D. Hobart; F.J. Kub